Stripwire Single-Phase Solid-State Relay Assemblies
SCR output DIN or panel mount solid-state relay power controllers
Ratings up-to 70 amps @ 48-660Vac in a 40°C ambient
4-32Vdc or 90-140Vac input / control voltage
LED input status indicator
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Box clamp terminals for bare wire termination up-to 8 AWG
Direct-power lead-frame design reduces solder joints and enhances reliability
MTBF > 7 million hours (>800 years)
IP20 touch-safe housing
EMC compliant, level 3
Agency approvals; cURus and CE
HKD4830-1 (Crydom CKRD4830P)
22.5mm 25 Amp / 48-530Vac, DC Input
Box clamp terminals for bare wire termination up-to 8 AWG
4-32Vdc input
Zero-crossing 48-530Vac / 25A output @ 40C
Internal transient overvoltage protection
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HKA4830-1 (Crydom CKRA4830)
22.5mm 25 Amp / 48-530Vac, AC Input
Box clamp terminals for bare wire termination up-to 8 AWG
110-280Vac input
Zero-crossing 48-530Vac / 25A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HKD6030-1 (Crydom CKRD6030)
22.5mm 25 Amp / 48-660Vac, DC Input
Box clamp terminals for bare wire termination up-to 8 AWG
4-32Vdc input
Zero-crossing 48-660Vac / 25A output @ 40C
Internal transient overvoltage protection
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HKA6030-1 (Crydom CKRA6030)
22.5mm 25 Amp / 48-660Vac, AC Input
Box clamp terminals for bare wire termination up-to 8 AWG
110-280Vac input
Zero-crossing 48-660Vac / 25A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-650CHDA
45mm 30 Amp / 48-660Vac, DC Input
Box clamp terminals for bare wire termination up-to 8 AWG
4-32Vdc input
Zero-crossing, 48-660Vac / 30A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-650CHAA
45mm 30 Amp / 48-660Vac, AC Input
Box clamp terminals for bare wire termination up-to 8 AWG
90-140Vac input
Zero-crossing, 48-660Vac / 30A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-690CHDA
45mm 40 Amp / 48-660Vac, DC Input
Box clamp terminals for bare wire termination up-to 8 AWG
4-32Vdc input
Zero-crossing 48-660Vac / 40A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-690CHAA
45mm 40 Amp / 48-660Vac, AC Input
Box clamp terminals for bare wire termination up-to 8 AWG
90-140Vac input
Zero-crossing 48-660Vac / 40A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-690CHDL
50 Amp / 48-660Vac, DC Input
Box clamp terminals for bare wire termination up-to 8 AWG
4-32Vdc input
Zero-crossing, 48-660Vac / 50A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-690CHAL
50 Amp / 48-660Vac, AC Input
Box clamp terminals for bare wire termination up-to 8 AWG
90-140Vac input
Zero-crossing, 48-660Vac / 50A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-690CHDXK
60 Amp / 48-660Vac, DC Input
Box clamp terminals for bare wire termination up-to 8 AWG
4-32Vdc input
Zero-crossing 48-660Vac / 60A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-690CHAXK
60 Amp / 48-660Vac, AC Input
Box clamp terminals for bare wire termination up-to 8 AWG
90-140Vac input
Zero-crossing, 48-660Vac / 60A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-690CHDN
70 Amp / 48-660Vac, DC Input
Box clamp terminals for bare wire termination up-to 8 AWG
4-32Vdc input
Zero-crossing, 48-660Vac / 70A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housing
HBC-690CHAN
70 Amp / 48-660Vac, AC Input
Box clamp terminals for bare wire termination up-to 8 AWG
90-140Vac input
Zero-crossing, 48-660Vac / 70A output @ 40C
Thermally efficient heat sink to maximize overall product life expectancy
Direct-bond copper (DBC) substrate for superior thermal performance
Direct-power lead-frame design reduces solder joints and enhances reliability
Touch-safe housingDirect-power lead-frame design reduces solder joints and enhances reliability